DIN EN IEC 61189-2-501
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (IEC 91/1634/CD:2019); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2020 |
| Status: | inactive |
| Page Count: | 30 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 61189-2-501
December 1, 2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials (IEC 91/1634/CD:2019); Text in German and English
A description is not available for this item.