DIN EN IEC 61189-2-807
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD:2020); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2020 |
| Status: | inactive |
| Page Count: | 14 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 61189-2-807
December 1, 2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD:2020); Text in German and English
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