BSI - 20/30427157 DC
Draft BS IEC 61189-2-808 Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method
pending
| Organization: | BSI |
| Publication Date: | 8 December 2020 |
| Status: | pending |
| Page Count: | 17 |
| ICS Code (Open systems interconnection in general): | 35.100.01 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
October 29, 2021
Draft BS EN IEC 61189-2-808 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-808: Thermal resistance of an assembly by thermal transient method
A description is not available for this item.
20/30427157 DC
December 8, 2020
Draft BS IEC 61189-2-808 Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method
A description is not available for this item.