IPC - J-STD-005 JAPANESE
Requirements for Soldering Pastes
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| Organization: | IPC |
| Publication Date: | 1 September 2018 |
| Status: | active |
| Page Count: | 24 |
Document History
J-STD-005 JAPANESE
September 1, 2018
Requirements for Soldering Pastes
A description is not available for this item.
January 1, 1995
Requirements for Soldering Pastes
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control...