IEC 61188-6-2
Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)
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| Organization: | IEC |
| Publication Date: | 1 February 2021 |
| Status: | active |
| Page Count: | 54 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
Document History
IEC 61188-6-2
February 1, 2021
Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)
This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These...