NPFC - MIL-I-24092/6
Insulating Resin, Solventless, Thixotropic, Baking, Flexible, for Dip Processing, Grade Set, Class 130 to 180 Thermal Class
active, Most Current
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| Organization: | NPFC |
| Publication Date: | 18 February 2021 |
| Status: | active |
| Page Count: | 1 |
Document History
MIL-I-24092/6
February 18, 2021
Insulating Resin, Solventless, Thixotropic, Baking, Flexible, for Dip Processing, Grade Set, Class 130 to 180 Thermal Class
A description is not available for this item.
September 21, 1993
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, FLEXIBLE, FOR DIP PROCESSING, GRADE SFT, CLASS 130 TO 180 THERMAL CLASS
This specification is approved for use by all departments and agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of this specification...
May 4, 1989
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, FLEXIBLE, FOR DIP PROCESSING, GRADE SFT, CLASS 130 TO 180 THERMAL CLASS
A description is not available for this item.