(R) Insulating Compound, Electrical, Embedding, Reversion Resistant Silicone
|Publication Date:||1 March 2021|
This specification covers the requirements for two types of a two-part, transparent, reversion resistant flexible insulating compound, to provide resilient, environmental, and electrical insulation of components in systems in temperature range -85 to 392 °F (-65 to 200 °C). These insulating compounds are intended for embedding, potting or encapsulation of electrical and electronic components in systems where tear resistance is not critical, but their use is not limited to such applications. These transparent compounds allow visual circuit and part identification and facilitate part replacement and repairs. The insulating compound shall cure in sections of unlimited thickness, either exposed to air or completely sealed.
Insulating compounds covered by this specification shall be of the following types:
Type I - Room temperature curing.
Type II - Heat curing.
Type I compound is intended for general purpose potting and embedding of electronic equipment where it is not convenient to heat the equipment. Type I material has low dielectric losses that do not change appreciably over a temperature range of -67 to 310 °F (-55 to 154 °C). It is intended for use where protection from thermal cycling, mechanical shock, vibration, and moisture is required.
Type II compound is intended for general purpose potting and embedding of electronic equipment and shall have the same electrical properties as Type I when cured. Type II is used when the electronic parts can be heated and provides faster processing during the embedding procedure.
Safety - Hazardous Materials
Shall be in accordance with AS5502 (1.1).