BSI - BS EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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| Organization: | BSI |
| Publication Date: | 31 March 2021 |
| Status: | active |
| Page Count: | 32 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61188-6-2
March 31, 2021
Circuit boards and circuit board assemblies - Design and use Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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