BSI - BS IEC 62047-35
Semiconductor devices - Micro-electromechanical devices Part 35: Test method of electrical characteristics under bending deformation for flexible electromechanical devices
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| Organization: | BSI |
| Publication Date: | 30 April 2021 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS IEC 62047-35
April 30, 2021
Semiconductor devices - Micro-electromechanical devices Part 35: Test method of electrical characteristics under bending deformation for flexible electromechanical devices
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