DIN 50002-1
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
active, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2020 |
| Status: | active |
| Page Count: | 17 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Adhesives): | 83.180 |
Document History
DIN 50002-1
March 1, 2020
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
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