BSI - 21/30441791 DC
Draft BS EN IEC 61189-2-809 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
pending, Most Current
| Organization: | BSI |
| Publication Date: | 30 July 2021 |
| Status: | pending |
| Page Count: | 10 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Paper and board insulating materials): | 29.035.10 |
Document History
21/30441791 DC
July 30, 2021
Draft BS EN IEC 61189-2-809 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
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