DSF/PREN IEC 61189-2-801
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
inactive
| Organization: | DS |
| Status: | inactive |
| Page Count: | 12 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
Document History
September 13, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal...
DSF/PREN IEC 61189-2-801
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal...