DSF/PREN IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 9 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
Document History
DSF/PREN IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this...