DSF/PREN IEC 61189-2-805
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 11 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Document History
DSF/PREN IEC 61189-2-805
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical...