BSI - 22/30443234 DC
Draft BS EN 63378-3 Ed.1.0 Thermal standardization on semiconductor packages. Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis
pending
| Organization: | BSI |
| Publication Date: | 24 January 2022 |
| Status: | pending |
| Page Count: | 19 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
February 3, 2023
Draft BS EN 63378-3 Thermal standardization on semiconductor packages Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
A description is not available for this item.
22/30443234 DC
January 24, 2022
Draft BS EN 63378-3 Ed.1.0 Thermal standardization on semiconductor packages. Part 3: Thermal circuit simulation models of semiconductor packages for transient analysis
A description is not available for this item.