ETSI - TS 103 813
Smart Secure Platform (SSP); Test Specification, SPI interface (Release 15)
active, Most Current
| Organization: | ETSI |
| Publication Date: | 1 February 2022 |
| Status: | active |
| Page Count: | 123 |
scope:
The present document covers the minimum characteristics which are considered necessary for the Serial Peripheral Interface (SPI) communication of an SSP in order to provide compliance to ETSI TS 103 713 [1].
The present document specifies the test cases for:
• the physical layer (electrical characteristics);
• the MAC layer;
• the data link layer; and
• the SHDLC layer (as defined in ETSI TS 102 613 [5])
of the SPI.
Tests for the usage of an SPI different to what is defined in ETSI TS 103 713 [1] are out of scope of the present document.
Document History
TS 103 813
February 1, 2022
Smart Secure Platform (SSP); Test Specification, SPI interface (Release 15)
The present document covers the minimum characteristics which are considered necessary for the Serial Peripheral Interface (SPI) communication of an SSP in order to provide compliance to ETSI TS 103...
February 1, 2021
Smart Secure Platform (SSP); Test Specification, SPI interface
The present document covers the minimum characteristics which are considered necessary for the Serial Peripheral Interface (SPI) communication of an SSP in order to provide compliance to ETSI TS 103...