IEC - 61189-2-501
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 February 2022 |
| Status: | active |
| Page Count: | 36 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
Document History
61189-2-501
February 1, 2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under...