DIN EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
pending, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2022 |
| Status: | pending |
| Page Count: | 29 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 61189-2-808
March 1, 2022
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
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