AENOR - UNE-EN IEC 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
active, Most Current
| Organization: | AENOR |
| Publication Date: | 1 April 2021 |
| Status: | active |
| Page Count: | 50 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
UNE-EN IEC 61189-5-601
April 1, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
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