BSI - BS EN IEC 61189-2-501
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 May 2022 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-2-501
May 31, 2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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