CEI - EN IEC 62878-2-602
Device embedding assembly technology Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
active, Most Current
| Organization: | CEI |
| Publication Date: | 1 April 2022 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Document History
EN IEC 62878-2-602
April 1, 2022
Device embedding assembly technology Part 2-602: Guideline for stacked electronic module - Evaluation method of intermodule electrical connectivity
This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.