DSF/PREN IEC 61249-2-51
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated Circuit card carrier tape, unclad
inactive
| Organization: | DS |
| Status: | inactive |
| Page Count: | 17 |
scope:
This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape, unclad(hereinafter referred to as IC carrier tape base materials). This standard is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Document History
June 19, 2023
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for integrated circuit card carrier tape, unclad
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad...
DSF/PREN IEC 61249-2-51
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated Circuit card carrier tape, unclad
This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape,...
Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated circuit card carrier tape, unclad
This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape,...