DSF/PREN IEC 61189-2-809
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 10 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used, and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
Document History
DSF/PREN IEC 61189-2-809
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
This International Standard defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical...