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IEC - TR 63357

Semiconductor devices – Standardization roadmap of fault test method for automotive vehicles

active, Most Current
Organization: IEC
Publication Date: 1 October 2022
Status: active
Page Count: 18
ICS Code (Other semiconductor devices): 31.080.99
scope:

This Technical Report describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.

Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.

Document History

TR 63357
October 1, 2022
Semiconductor devices – Standardization roadmap of fault test method for automotive vehicles
This Technical Report describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as...

References

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