scope:

This standard applies to equipment design and construction features with regard to the following items:

• Both metallic and non-metallic materials of construction. These materials may be used in ducts, pumps, piping, housings, etc.

• Electrical systems with regard to preventing an electrical incident leading to contamination of the clean room and mitigation of fire.

• Compatibility with regard to potentially flammable or combustible chemicals integral to the equipment operation.

• Installation and operation of fixed fire detection/suppression equipment when applicable and supplied as part of the equipment.

• Ventilation, gas or vapor leak detection and liquid leak detection and containment.

• Assessment of the associated mechanical/electrical engineering controls, limiting devices, emergency off, and/or safety interlocks.

Purpose

This standard is the basis for the certification agency's designation of manufacturing equipment (i.e., "Tools") used by the semiconductor industry in semiconductor cleanroom manufacturing occupancies where the processing of semiconductor components, such as microprocessors, memory components, etc., takes place. This standard provides for listing of semiconductor manufacturing equipment as it relates to promoting the practice of property conservation and business continuity.

Testing and certification criteria may include, but are not limited to, performance requirements, marking requirements, examination of manufacturing facility(ies), audit of quality assurance procedures, and a surveillance program.