scope:

Commented versions are a valuable improvement upon the conventional IEC Redline Version (RLV). These versions are designed to facilitate a clearer understanding of the revisions made between the prior and current editions of a publication. This enhanced product package incorporates both the most recent edition of the document and the annotated redline version. This combined offering provides users with an easily accessible means to track and comprehend the alterations and additions that have been made, thereby enhancing the utility and effectiveness of the publication for its intended audience.

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).