IPC - 2292A
Design Standard for Printed Electronics on Flexible Substrates
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 October 2022 |
| Status: | active |
| Page Count: | 56 |
scope:
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials, devices or functionalized circuitry which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable.
Document History
2292A
October 1, 2022
Design Standard for Printed Electronics on Flexible Substrates
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...
March 1, 2018
Design Standard for Printed Electronics on Flexible Substrates
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible...