BSI - 23/30469486 DC
Draft BS EN IEC 63378-2 Thermal standardization on semiconductor packages Part 2: 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
pending, Most Current
| Organization: | BSI |
| Publication Date: | 7 February 2023 |
| Status: | pending |
| Page Count: | 18 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
23/30469486 DC
February 7, 2023
Draft BS EN IEC 63378-2 Thermal standardization on semiconductor packages Part 2: 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
A description is not available for this item.