DSF/PREN IEC 61189-2-720
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 12 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This document provides a method to evaluate specific characteristics of printed boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Document History
DSF/PREN IEC 61189-2-720
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
This document provides a method to evaluate specific characteristics of printed boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative...