DSF/PREN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 20 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This document describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. It is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. Note: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Document History
DSF/PREN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of an assembly by thermal transient method
This document describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a...