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DS/EN IEC 61158-4-2

Industrial communication networks – Fieldbus specifications – Part 4-2: Data-link layer protocol specification – Type 2 elements

active, Most Current
Organization: DS
Publication Date: 18 April 2023
Status: active
Page Count: 412
ICS Code (Networking): 35.110
ICS Code (Data link layer): 35.100.20
ICS Code (Industrial process measurement and control): 25.040.40
scope:

IEC 61158-4-2:2023 is one of a series produced to facilitate the interconnection of automation system components. It is related to other standards in the set as defined by the "three-layer" fieldbus reference model described in IEC 61158‑1. The data-link protocol provides the data-link service by making use of the services available from the physical layer. The primary aim of this document is to provide a set of rules for communication expressed in terms of the procedures to be carried out by peer data-link entities (DLEs) at the time of communication. These rules for communication are intended to provide a sound basis for development in order to serve a variety of purposes: - as a guide for implementers and designers; - for use in the testing and procurement of equipment; - as part of an agreement for the admittance of systems into the open systems environment; - as a refinement to the understanding of time-critical communications within OSI.

Document History

DS/EN IEC 61158-4-2
April 18, 2023
Industrial communication networks – Fieldbus specifications – Part 4-2: Data-link layer protocol specification – Type 2 elements
IEC 61158-4-2:2023 is one of a series produced to facilitate the interconnection of automation system components. It is related to other standards in the set as defined by the "three-layer" fieldbus...
June 24, 2019
Industrial communication networks – Fieldbus specifications – Part 4-2: Data-link layer protocol specification – Type 2 elements
1.1 General The data-link layer provides basic time-critical messaging communications between devices in an automation environment. This protocol provides communication opportunities to all...
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