scope:

The scope of the test method is to describe a procedure for measurement of thermal resistance and calculation of an apparent thermal conductivity for single layer Metal Based Printed Boards (MBPB). This test method has been created to address the issue of measurement uncertainty for materials with low thermal resistance (high thermal conductivity and/or thin thicknesses).

Precise measured values of thermal resistance are very important, for multiple applications, especially within automotive sector, but also in other areas. For materials with a low thermal resistance, the measurement uncertainty increases significantly when using the steady state measuring method. The target for this test method is to provide good repeatability and reproducibility in the test result. A certified reference material must be used to guarantee the measurement quality.

The test method shall show a validity of different thermal resistance values represented by different thicknesses and materials used for the MBPB. The test method shall also describe a reliable thickness measurement.