DIN EN IEC 62878-2-603
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
pending, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 2023 |
| Status: | pending |
| Page Count: | 22 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 62878-2-603
July 1, 2023
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English
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