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BSI - 23/30477066 DC

Draft BS EN IEC 62674-1 High frequency inductive component Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment

pending
Organization: BSI
Publication Date: 20 July 2023
Status: pending
Page Count: 32
ICS Code (Magnetic components): 29.100.10

Document History

23/30477066 DC
July 20, 2023
Draft BS EN IEC 62674-1 High frequency inductive component Part 1: Fixed surface mount inductors for use in electronic and telecommunication equipment
A description is not available for this item.
BS EN 62674-1
January 31, 2013
High Frequency Inductive Components - Fixed surface mount inductors for use in electronic and telecommunication equipment
A description is not available for this item.

References

This document references:
IEC 60068-2-1 - Environmental testing – Part 2-1: Tests – Test A: Cold
Published by IEC on March 1, 2007
Introduction General This publication deals with cold tests appliable both to non heat-dissipating and heat-disspating specimens. for no heat-disspating specimens, Tests Aa and Ab do not deviate...
This document references:
IEC 60068-2-2 - Environmental testing – Part 2-2: Tests – Test B: Dry heat
Published by IEC on July 1, 2007
INTRODUCTION General This publication deals with dry heat tests applicable both to heat-dissipating and non heat-dissipating specimens. For non heat-dissipating specimens, Tests Ba and Bb do not...
This document references:
IEC 60068-2-45 - Basic Environmental Testing Procedures Part 2: Tests Test XA and Guidance: Immersion in Cleaning Solvents
Published by IEC on January 1, 1980
A description is not available for this item.
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
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