IEC - 61189-2-801
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 July 2023 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
Document History
61189-2-801
July 1, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal...