BSI - BS IEC 61189-2-801
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-801: Thermal conductivity test for base materials
inactive
| Organization: | BSI |
| Publication Date: | 31 August 2023 |
| Status: | inactive |
| Page Count: | 14 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
August 31, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-801: Thermal conductivity test for base materials
A description is not available for this item.
BS IEC 61189-2-801
August 31, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-801: Thermal conductivity test for base materials
A description is not available for this item.