BSI - BS IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-804: Test methods for time to delamination — T260, T288, T300
inactive
| Organization: | BSI |
| Publication Date: | 31 August 2023 |
| Status: | inactive |
| Page Count: | 12 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
August 31, 2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-804: Test methods for time to delamination - T260, T288, T300
A description is not available for this item.
BS IEC 61189-2-804
August 31, 2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-804: Test methods for time to delamination — T260, T288, T300
A description is not available for this item.