DSF/PREN IEC 61188-6-3
Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 31 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1, and IEC 61191-3.
Document History
DSF/PREN IEC 61188-6-3
Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)
This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of...