DS/EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
active, Most Current
| Organization: | DS |
| Publication Date: | 13 September 2023 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
Document History
DS/EN IEC 61189-2-803
September 13, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).