DSF/PREN IEC 62878-2-603
Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 14 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.
Document History
DSF/PREN IEC 62878-2-603
Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity
This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable...