DSF/PREN IEC 60749-34-1
Semiconductor devices – Mechanical and climatic test methods – Part 34-1: Power cycling test for power semiconductor module
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 26 |
scope:
This part of IEC IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the power dissipation of the internal semiconductors and the internal connectors. It is based on IEC 60749 -34, Power cycling, but is developed specifically for silicon-based power semiconductor module products. This test causes wear-out and is considered destructive.
Document History
DSF/PREN IEC 60749-34-1
Semiconductor devices – Mechanical and climatic test methods – Part 34-1: Power cycling test for power semiconductor module
This part of IEC IEC 60749 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the power...