JSA - JIS Z 3284-3
Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness
active, Most Current
| Organization: | JSA |
| Publication Date: | 22 January 2024 |
| Status: | active |
| ICS Code (Brazing and soldering): | 25.160.50 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
JIS Z 3284-3
January 22, 2024
Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness
A description is not available for this item.
June 20, 2014
Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
A description is not available for this item.