SAE International - AMS3684C
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
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| Organization: | SAE International |
| Publication Date: | 13 October 2016 |
| Status: | active |
description:
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
Document History
AMS3684C
October 13, 2016
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.