SAE International - SSB1_002
Environmental Tests and Associated Failure Mechanisms
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| Organization: | SAE International |
| Publication Date: | 12 September 2014 |
| Status: | active |
description:
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged... View More
Document History
July 7, 2021
Radiation Hardness Assurance
This document is an annex to SAE Technical Report SSB-1 (the latest revision). This document provides reference information and guidance concerning methods used by the semiconductor industry and...
September 12, 2014
Qualification and Reliability Monitors
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the...
SSB1_002
September 12, 2014
Environmental Tests and Associated Failure Mechanisms
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This...
September 12, 2014
Acceleration Factors
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the...
April 1, 2009
Failure Rate Estimating
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the...