SAE International - ARP6415
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
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| Organization: | SAE International |
| Publication Date: | 23 July 2019 |
| Status: | active |
description:
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high... View More
Document History
ARP6415
July 23, 2019
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high...