SAE International - AMS3731/2D
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
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| Organization: | SAE International |
| Publication Date: | 22 September 2016 |
| Status: | active |
description:
This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
Document History
AMS3731/2D
September 22, 2016
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.