This document describes the requirements of the following test methods for counterfeit detection of electronic components:

a

Method A: General EVI, Sample Selection, and Handling

b

Method B: Detailed EVI, including Part Weight measurement

c

Method C: Testing for Remarking

d

Method D: Testing for Resurfacing

e

Method E: Part Dimensions measurement

f

Method F: Surface Texture Analysis using SEM

The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.