CEI EN 60191-6-5
Mechanical standardization of semiconductor devices Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
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| Organization: | CEI |
| Publication Date: | 1 February 2002 |
| Status: | active |
| Page Count: | 18 |
scope:
Norma recepita mediante l'annuncio su CEINFORMA febbraio 2002.
Document History
CEI EN 60191-6-5
February 1, 2002
Mechanical standardization of semiconductor devices Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Norma recepita mediante l'annuncio su CEINFORMA febbraio 2002.