scope:

The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This specification does not apply to components with bottom-only terminations where the full plated surface is wetted during assembly (for example: quad flat no leads and ball grid array components, flip chip bump terminations). Adherence to this standard shall include meeting the reporting requirements described in Clause 6.