FORD WSS-M11A32-A4
SOLDER PASTE, 10 SN/88 PB/2 AG, LOW VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
inactive, Most Current
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| Organization: | FORD |
| Publication Date: | 25 July 2012 |
| Status: | inactive |
| Page Count: | 3 |
scope:
The materials defined by these specifications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing applications. These solder pastes are homogeneous suspensions of prealloyed solder powder in specially formulated screening and fluxing vehicle systems.
Document History
FORD WSS-M11A32-A4
July 25, 2012
SOLDER PASTE, 10 SN/88 PB/2 AG, LOW VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
The materials defined by these specifications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing applications....
February 7, 2005
SOLDER PASTE, 10 SN/88 PB/2 AG, LOW VISCOSITY ***TO BE USED WITH FORD WSS-M99P1111-A***
The materials defined by these specifications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing applications....
January 10, 1996
SOLDER PASTE, 10 SN/88 PB/2 AG, LOW VISCOSITY
1. SCOPE The materials defined by these specifications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing...